Drop Test Simulation for Electronics & Enclosures

What we do

We simulate device drops and shocks—so your electronics and enclosures survive the lab and the real world. Using explicit dynamics FEA and correlation-ready load cases, we predict crack/clip failures, boss pull-out, PCB hot-spots, display/glass risks, and then deliver clear design changes that raise pass rates and cut prototypes.

Outcomes we target

  • Verified survivability for typical drop heights/orientations
  • Lower peak strains in plastics, bosses, and screw seats
  • Reduced PCB component and solder-joint risk (board-level checks)
  • Weight-neutral stiffness & damping improvements (ribs/foams)
  • Evidence pack aligned with common lab methods (e.g., IEC/MIL/JEDEC/ISTA)*

* We align test plans and evidence with common standards; certification remains with your selected lab/body.

Services

  • Test Mapping & Acceptance Criteria – orientations, heights, floor types; pass/fail metrics aligned with typical lab procedures.
  • CAD Prep & Meshing – defeaturing, contact partitions, fasteners and snap-fits; rate-sensitive plastics and elastomer models.
  • Drop/Impact FEA (Explicit) – floor models (steel, concrete, wood), friction/contact tuning, secondary impacts, corner/edge/face cases.
  • Enclosure Weak-Point Analysis – ribs, bosses, latch/clip design, living hinges, standoffs; buckling and crack initiation risk.
  • PCB Interaction – board support strategy, mass-lumped components or detailed submodels, hotspot ranking for BGAs/connectors.
  • Display/Battery Protection – glass stack stress checks, foam/TPU isolation, frame stiffness tuning, potting and gap analyses.
  • Optimization Loops – topology/shape/size changes, material swaps, foam pads/gaskets; cost/weight trade studies.
  • Test Planning & Correlation – fixture drawings, sensor layout, camera/DAQ plan, acceptance matrix; sim↔lab update.

Deliverables you receive

  • Engineering Report (PDF): assumptions, meshes, loads/BCs, results, risks, and ranked design actions.
  • Result Packs: animations, hotspot plots, CSV maxima/time histories, photo-like views for stakeholders.
  • Design Markups: CAD callouts for ribs/fillets, boss geometry, screw/insert choices, foam/gasket locations.
  • Solver Files: ANSYS/Abaqus/LS-DYNA decks and post-processing templates.
  • Validation Plan: test list, acceptance table, correlation checklist.
  • Handover Session: 45–90 min walkthrough + Q&A.

Technical stack

  • Solvers: ANSYS Explicit/Mechanical, Abaqus Explicit/Standard, LS-DYNA, Nastran
  • Pre/Post: Workbench, ANSA/HyperMesh, Meta/Post, Python notebooks
  • Materials: ABS/PC/PA/PP, glass-filled plastics, elastomers/foams, Al/Mg, sheet metal, glass stacks, adhesives
  • Assemblies: handhelds, wearables, consumer & industrial enclosures, battery modules, 19" rack units, instrument housings

How an engagement works

  1. Discovery – goals, target tests, constraints, known failures.
  2. Data & Setup – CAD, materials, stack-ups; mesh and contact strategy, acceptance criteria.
  3. Baseline Simulation – representative orientation/floor; quick risks and early fixes.
  4. Iteration & Optimization – design changes → re-sims → converge on acceptance.
  5. Validation – test plan, optional lab correlation, final report & assets.

What we need from you

  • CAD (STEP/Parasolid), assembly stack-ups, fastener and insert details
  • Materials (datasheets/allowables), gasket/foam specs, adhesive notes
  • Intended drops: heights, orientations, floor types; shipping/storage risks
  • Success criteria (e.g., no functional loss, no cracks, max strain at X%)

Packages (example framing—set your own prices)

  • Assessment – quick baseline drop, hotspot map, prioritized actions.
  • Simulation Sprint – multiple orientations/floors + optimization loops, design markups, report.
  • Correlation & Optimization – test plan, fixture advice, sim↔lab update, weight/cost trade studies.

Example use cases

  • Handheld meter passes 1.0–1.5 m drops: ribs + clip redesign cut boss strain by >30%.
  • Battery pack gains foam isolation + standoff tuning to protect tabs/connectors.
  • Rack module survives corner impacts via bracket stiffening and screw pattern changes.
  • Wearable keeps glass intact with bezel stiffening and TPU bumpers.

FAQ

Which file formats do you accept?
STEP/Parasolid preferred; we can handle native CAD as needed.

Can you include PCB failure risk?
Yes—either mass-lumped components for global effects or detailed submodels for local solder/joint stress trends.

Do you simulate multiple drops?
We can model sequences/statistics and advise where physical testing is more efficient.

How accurate are the material models?
We use rate-dependent plasticity and foam laws where available; if data is missing, we apply conservative proxies and sensitivity checks.

Will you share solver decks and animations?
Absolutely—they’re part of the deliverables.