HighTech Adhesive

HighTech Adhesive is our liquid 2 W/mK thermal glue for demanding power electronics and cooling applications. The silicone-based formula with aluminium fillers ensures reliable bonding and efficient heat transfer for a wide range of components.

Key features:

• 2 W/mK thermal conductivity for fast heat dissipation

• Strong adhesion, even for heavy heatsinks

• Electrically insulating – protects against short circuits

• Easy to apply, surface dry after approx. 20 minutes

• Recommended layer thickness: 0.1–0.5 mm (up to 24 h curing above 0.5 mm)

• Wide operating range from −60 °C to +250 °C

Ideal for heatsinks on LEDs, RAM, GPUs, SSDs, ICs, power stages, motor controllers and other high-performance electronic assemblies.