Drop Test Simulation for Electronics and Enclosures

What we do

We simulate drops and impacts before your devices ever reach the test bench or customers.
Using explicit dynamic FEA, we replicate typical drop scenarios (height, orientation, surface) and predict:

  • cracks and clip failures in the housing

  • pull-out or overload of inserts and screws

  • hotspots on the PCB and in solder joints

  • risks to displays, glass stacks, and battery modules

The output isn’t “pretty pictures,” but concrete geometry changes that:

  • increase pass rates in lab tests

  • reduce the number of prototype iterations

The outcomes we aim for

  • Proven survivability for defined drop heights and directions

  • Reduced peak strains/stresses in plastic parts, mounting points, and screw seats

  • Lower failure risk on the PCB (components, connectors, solder joints)

  • Weight-neutral improvements in stiffness and damping via ribs, foams, TPU elements

  • A documented “evidence package” aligned with common standards and lab methods (e.g., IEC, MIL, JEDEC, ISTA — certification is performed by your test lab)

Services

Test mapping & acceptance criteria

Deriving drop cases from your target standards: orientations, drop heights, surface types, number of repetitions, and pass/fail criteria such as “no loss of function, no cracks, no glass breakage.”

CAD preparation & meshing

Cleaning and simplifying geometry; defining contact areas, fasteners, snap-fits, and living hinges; material models for strain-rate-dependent plastics and elastomers.

Drop/impact FEA (explicit)

Explicit drop simulations with surface models (steel, concrete, wood, rubber), frictional contacts, corner/edge/face drops, secondary impacts, and sliding/rolling.

Housing weak-point analysis

Assessment of ribs, clips, latches, standoffs, and living hinges — including buckling, snap, and crack risk.

PCB interaction

Modeling the PCB via mass-reduced components or detailed submodels; ranking component hotspots (e.g., BGAs, connectors, large electrolytics).

Display and battery protection

Studying glass-stack stresses, frame stiffness, foam/TPU inserts, potting and gaps to prevent glass breakage and internal short circuits.

Optimization loops

Iterative adjustments to topology, wall thickness, ribs, materials, foam/seal concept — each with cost/weight comparisons.

Test planning & correlation

Fixture concepts, sensor layout (accelerometers, strain gauges, DIC), camera and DAQ plan, acceptance matrix, and simulation↔lab correlation.

What you get (deliverables)

  • Engineering report (PDF) — assumptions, model build, meshes, material cards, load cases, results with hotspot markings, and a clearly prioritized action list.

  • Results packages — animations, strain/stress plots, rankings, time-history data (CSV), and presentation-ready screenshots.

  • CAD markups — concrete proposals for ribs, fillets, clip geometries, screw/insert concepts, foam and seal locations.

  • Solver decks — runnable models (e.g., Ansys, Abaqus, LS-DYNA) plus post-processing templates.

  • Validation plan — test list, acceptance criteria, correlation table simulation↔test.

  • Handover session — 45–90 minute live walkthrough with your team incl. Q&A.

Technical stack

  • Solvers: Ansys Explicit/Mechanical, Abaqus Explicit/Standard, LS-DYNA, optionally Nastran for supplementary linear checks

  • Pre/Post: Workbench, ANSA/HyperMesh, Meta/Post, plus Python-based evaluation scripts

  • Materials: ABS, PC, PA, PP, glass-fiber reinforced plastics, elastomers and foams, Al/Mg alloys, sheet metal parts, glass stacks, adhesives and potting compounds

  • Typical assemblies: handheld devices, wearables, consumer and industrial housings, battery modules, 19" rack units, diagnostic/measurement devices

Typical project flow

  • Discovery — clarify goals, target standards, critical failure modes, and boundary conditions.

  • Data & setup — CAD, BOM, materials, layer stacks; define meshes, contact strategy, and acceptance criteria.

  • Baseline simulation — a representative drop (e.g., worst-case orientation/surface) for quick hotspot identification.

  • Iteration & optimization — design changes → re-simulate → stepwise convergence to target criteria.

  • Validation — test plan, optional accompanying lab correlation, final report with documented release recommendation.

What we need from you

  • CAD data (STEP/Parasolid), assembly structure, details on screws, inserts, clips, seals

  • Material data (datasheets, allowable stresses/strains, known weak points)

  • Planned drop scenarios: heights, orientations, surfaces, number of repetitions, transport/handling risks

  • Success criteria: e.g., no functional loss, no visible cracks, no glass breakage, max allowable strain X% at critical locations

Packages

  • Assessment — quick baseline simulation, hotspot map, prioritized action recommendation.

  • Simulation sprint — multiple orientations and heights, optimization loops, detailed report + CAD markups.

  • Correlation & optimization — support with test planning and fixtures, sim↔lab updates, variant/cost/weight comparisons.

Example applications

  • Handheld measurement device survives drops from ~1.0–1.5 m after rib layout and clip geometry were adjusted (>30% load reduction at mounting points).

  • Battery module with foam and standoff concept protects cells and terminals under drop and transport loads.

  • 19" rack module withstands corner impacts through reinforced mounting points and optimized screw pattern.

  • Wearable with reinforced bezel and TPU bumpers protects glass and electronics in everyday drops.

FAQ

Which file formats do you accept?
Preferably STEP or Parasolid. Native CAD formats can also be processed if needed.

Can you account for PCB failure risk?
Yes — either via mass-represented components to capture global effects, or via local submodels for solder-joint and connector hotspots.

Do you simulate multiple drops / drop sequences?
Yes. We can model drop sequences and variability, and recommend when physical tests become more sensible and cost-effective.

How good are the material models?
Where available we use strain-rate-dependent plasticity and foam laws. If data is missing, we use conservative approximations and sensitivity studies — transparently documented in the report.

Do we get solver decks and animations?
Yes. Models, post-processing setups, and animations are included and remain fully yours.

Contact us