HighTechCOM 2W/mK thermal adhesive, liquid 100g - Ultimate heat sink adhesive for heat sinks, LEDs, RAM, GPUs, and power electronics, silicone with aluminum components
€12,99
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HighTechCOM 2W/mK thermal adhesive, liquid 100g - Ultimate heat sink adhesive for heat sinks, LEDs, RAM, GPUs, and power electronics, silicone with aluminum components
€12,99
Product features
- High thermal conductivity: 2 W/mK for efficient heat dissipation and maximum performance of your electronic components.
- Strong adhesion: Provides reliable hold even for heavy heatsinks – for optimal cooling and longer service life.
- Easy application & fast curing: Easy to apply and dries quickly. Recommended layer thickness: 0.1–0.5 mm; surface-dry after approx. 20 minutes. For >0.5 mm, allow up to 24 hours for curing.
- Electrically insulating & safe: Non-conductive, protects against short circuits and helps prevent device damage.
- Versatile & economical: 100 g pack for many applications – e.g., heatsinks, LEDs, RAM, SMDs, GPUs, ICs, SSDs, chipsets, control boards and other electronic components.
Temperature range: −60 °C to +250 °C.